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LM399 Datasheet(PDF) 13 Page - Analog Devices |
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LM399 Datasheet(HTML) 13 Page - Analog Devices |
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13 / 16 page ![]() Data Sheet ADR1399 APPLICATIONS INFORMATION analog.com Rev. A | 13 of 16 AVOIDING THERMOCOUPLE ERRORS Thermocouples occur whenever two dissimilar metals form a junc- tion. For example, the TO-46 package leads are made of Kovar™ and are usually soldered to a copper trace in a PCB design. Kovar copper junctions are known to cause thermocouple voltages of 35 μV/°C, which is about 25 times higher than the typical tempera- ture coefficient of the ADR1399. To minimize thermocouple induced voltage errors, ensure that junctions in series with critical pins always see the same temperature as the corresponding junction in the return path. For the TO-46 of the ADR1399, this results in the need to avoid temperature gradients at the two points where the Zener pins contact the PCB. SHUNT DYNAMIC IMPEDANCE AND CAPACITIVE LOAD The ADR1399 offers reduced output shunt dynamic impedance over the LM399, which is often dismissed as an advancement that is not critical. However, considering the need for high stability in the presence of supply fluctuations and RSHUNT drift, the low dynamic impedance of the ADR1399 is advantageous. Consider, for example, the effect of a 0.1% change in supply voltage on a 15 V supply running 3 mA into an ADR1399 through a 2.67 kΩ RSHUNT. The extra supply voltage causes an extra 5.6 μA to flow, which, on the 40 mΩ dynamic impedance of the TO-46 version of the ADR1399, increases the reference voltage by 0.22 μV. The same supply shift onto an LM399 design and into its typical 0.5 Ω dynamic impedance induces a considerable 2.8 μV of reference shift. Therefore, the improvement in dynamic impedance allows a better opportunity for maintaining high stability in the most critical shunt reference output voltage. Similarly, one can calculate for the effects due to changes in the RSHUNT value. One of the trade-offs of achieving the reduced dynamic impedance, however, is an increased sensitivity to direct capacitive loading. The LM399 is stable with a wide range of capacitive load. The ADR1399 starts to ring with direct capacitive loads of more than a few hundred pF, and oscillates with 10 nF directly. The ADR1399 is optimized for an external compensation series network of ~5 Ω and 1 μF, as shown in Figure 36 to Figure 41 (see the Typical Applications section). If updating a legacy design with excessive capacitance for the ADR1399, and there is nowhere to add a series 5 Ω, reduce the capacitance to less than 1 nF if possible. Another single element passive that works directly with the ADR1399 is a 10 μF tantalum capacitor, even though the series resistance can measure less than 5 Ω on an impedance analyzer. With the 8-terminal LCC version of the ADR1399, including new force and sense pins, the dynamic impedance is lower. With the +REFF and +REFS shorted together, and the −REFF and −REFS shorted together, and sensing across the ±REFS pins, the dynamic impedance is 11 mΩ in magnitude, with 180 degrees of phase at low frequency, or −11 mΩ at DC. TYPICAL APPLICATIONS Figure 36 through Figure 41 show basic connections for single-sup- ply, split supply, buffered references, negative heater supply with positive reference, and parallel references for lower noise opera- tion. Figure 36. Single-Supply Operation Figure 37. Split Supply Operation Figure 38. Buffered Operation Figure 39. Negative Heater Supply with Positive Reference Figure 40. Parallel References for Lower Noise |
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