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LM399 Datasheet(PDF) 13 Page - Analog Devices

Part # LM399
Description  Oven-Compensated, Buried Zener, 7.05 V Voltage Reference
PDF  16 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LM399 Datasheet(HTML) 13 Page - Analog Devices

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Data Sheet
ADR1399
APPLICATIONS INFORMATION
analog.com
Rev. A | 13 of 16
AVOIDING THERMOCOUPLE ERRORS
Thermocouples occur whenever two dissimilar metals form a junc-
tion. For example, the TO-46 package leads are made of Kovar™
and are usually soldered to a copper trace in a PCB design. Kovar
copper junctions are known to cause thermocouple voltages of
35 μV/°C, which is about 25 times higher than the typical tempera-
ture coefficient of the ADR1399. To minimize thermocouple induced
voltage errors, ensure that junctions in series with critical pins
always see the same temperature as the corresponding junction in
the return path. For the TO-46 of the ADR1399, this results in the
need to avoid temperature gradients at the two points where the
Zener pins contact the PCB.
SHUNT DYNAMIC IMPEDANCE AND
CAPACITIVE LOAD
The ADR1399 offers reduced output shunt dynamic impedance
over the LM399, which is often dismissed as an advancement that
is not critical. However, considering the need for high stability in the
presence of supply fluctuations and RSHUNT drift, the low dynamic
impedance of the ADR1399 is advantageous.
Consider, for example, the effect of a 0.1% change in supply
voltage on a 15 V supply running 3 mA into an ADR1399 through
a 2.67 kΩ RSHUNT. The extra supply voltage causes an extra 5.6
μA to flow, which, on the 40 mΩ dynamic impedance of the TO-46
version of the ADR1399, increases the reference voltage by 0.22
μV. The same supply shift onto an LM399 design and into its
typical 0.5 Ω dynamic impedance induces a considerable 2.8 μV of
reference shift. Therefore, the improvement in dynamic impedance
allows a better opportunity for maintaining high stability in the most
critical shunt reference output voltage. Similarly, one can calculate
for the effects due to changes in the RSHUNT value.
One of the trade-offs of achieving the reduced dynamic impedance,
however, is an increased sensitivity to direct capacitive loading.
The LM399 is stable with a wide range of capacitive load. The
ADR1399 starts to ring with direct capacitive loads of more than a
few hundred pF, and oscillates with 10 nF directly. The ADR1399
is optimized for an external compensation series network of ~5 Ω
and 1 μF, as shown in Figure 36 to Figure 41 (see the Typical
Applications section). If updating a legacy design with excessive
capacitance for the ADR1399, and there is nowhere to add a series
5 Ω, reduce the capacitance to less than 1 nF if possible. Another
single element passive that works directly with the ADR1399 is a
10 μF tantalum capacitor, even though the series resistance can
measure less than 5 Ω on an impedance analyzer.
With the 8-terminal LCC version of the ADR1399, including new
force and sense pins, the dynamic impedance is lower. With the
+REFF and +REFS shorted together, and the −REFF and −REFS
shorted together, and sensing across the ±REFS pins, the dynamic
impedance is 11 mΩ in magnitude, with 180 degrees of phase at
low frequency, or −11 mΩ at DC.
TYPICAL APPLICATIONS
Figure 36 through Figure 41 show basic connections for single-sup-
ply, split supply, buffered references, negative heater supply with
positive reference, and parallel references for lower noise opera-
tion.
Figure 36. Single-Supply Operation
Figure 37. Split Supply Operation
Figure 38. Buffered Operation
Figure 39. Negative Heater Supply with Positive Reference
Figure 40. Parallel References for Lower Noise



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