SIP32452 datasheet(3/12 Pages) VISHAY

3 / 12 page

SiP32451, SiP32452, SiP32453

www.vishay.com

Vishay Siliconix

S20-0528-Rev. E, 06-Jul-2020

Document Number: 63315

For technical questions, contact: powerictechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

a. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum

b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing

c. For VIN outside this range consult typical EN threshold curve

PIN CONFIGURATION

Fig. 2 - WCSP4 2 x 2 Package

Output turn-on delay time

td(on)

VIN = 1.2 V

RLOAD = 10 ,

CL = 0.1 μF, TA = 25 °C

-0.4

μs

VIN = 2.5 V

0.05

Output turn-on rise time

VIN = 1.2 V

VIN = 2.5 V

9.8

Output turn-off delay time

td(off)

SiP32451, SiP32452

VIN = 1.2 V

-0.25

SiP32451, SiP32452

VIN = 2.5 V

-0.15

SiP32453, VIN = 1.2 V

150

SiP32453, VIN = 2.5 V

150

PIN DESCRIPTION

PIN NUMBER

NAME

FUNCTION

This pin is the n-channel MOSFET drain connection. Bypass to ground through a 4.7 μF capacitor

OUT

This pin is the n-channel MOSFET source connection. Bypass to ground through a 0.1 μF capacitor

Enable input

GND

Ground connection

SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS UNLESS SPECIFIED

VIN = 1 V, TA = -40 °C to +85 °C

(typical values are at TA = 25 °C)

LIMITS

UNIT

MIN. a

TYP. b

MAX. a

GND

OUT

Index-Bump A1

OUT

GND

Backside

Bumpside

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