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MSK0004 Datasheet(PDF) 3 Page - M.S. Kennedy Corporation |
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MSK0004 Datasheet(HTML) 3 Page - M.S. Kennedy Corporation |
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3 / 5 page ![]() APPLICATION NOTES 3 Rev. - 8/02 HEAT SINKING To determine if a heat sink is necessary for your appli- cation and if so, what type, refer to the thermal model and governing equation below. Thermal Model: Governing Equation: TJ = PD X (RθJC + RθCS + RθSA) + TA Where TJ = Junction Temperature PD = Total Power Dissipation RθJC = Junction to Case Thermal Resistance RθCS = Case to Heat Sink Thermal Resistance RθSA = Heat Sink to Ambient Thermal Resistance TC = Case Temperature TA = Ambient Temperature TS = Sink Temperature Example: The example demonstrates a worst case analysis for the op-amp output stage. This occurs when the output voltage is 1/2 the power supply voltage. Under this con- dition, maximum power transfer occurs and the output is under maximum stress. Conditions: VCC=±40VDC VO=±20Vp Sine Wave, Freq.=1KHz RL=1KΩ For a worst case analysis we treat the ±20Vp sine wave as an 8 VDC output voltage. 1.) Find driver power dissipation PD=(VCC-VO) (VO/RL) =(40V-20V) (20V/1KΩ) =400mW 2.) For conservative design, set TJ =+125°C. 3.) For this example, worst case TA =+100°C. 4.) RθJC = 16°C/W. 5.) RθCS=0.15°C/W for most thermal greases. 6.) Rearrange governing equation to solve for RθSA: RθSA= ((TJ - TA) / PD) - (RθJC) - (RθCS) = (125°C - 100°C)/0.4W - 16°C/W - 0.15°C/W =62.5 - 16.15 =46.4°C/W The heat sink in this example must have a thermal resistance of no more than 46.4°C/W to maintain a junc- tion temperature of less than +125°C. TYPICAL APPLICATION CIRCUIT REPLACING THE LH0004 The MSK 0004 is not an exact copy of the LM0004 but it is only slightly different. The MSK 0004 is inter- nally compensated and is lower cost. Pins 1,5,6,7 and 10 are not connected internally in the MSK0004. POWER SUPPLY BYPASSING Both the negative and positive power supplies must be effectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An effective deecoupling scheme consists of a 0.1 microfarad ceramic capacitor in parallel with a 4.7 mi- crofarad tantalum capacitor from each power supply pin to ground. |
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