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MSK0004 Datasheet(PDF) 3 Page - M.S. Kennedy Corporation

Part # MSK0004
Description  HIGH VOLTAGE OPERATIONAL AMPLIFIER
PDF  5 Pages
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Manufacturer  MSK [M.S. Kennedy Corporation]
Direct Link  http://www.mskennedy.com
Logo MSK - M.S. Kennedy Corporation

MSK0004 Datasheet(HTML) 3 Page - M.S. Kennedy Corporation

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APPLICATION NOTES
3
Rev. - 8/02
HEAT SINKING
To determine if a heat sink is necessary for your appli-
cation and if so, what type, refer to the thermal model
and governing equation below.
Thermal Model:
Governing Equation:
TJ = PD X (RθJC + RθCS + RθSA) + TA
Where
TJ
= Junction Temperature
PD
= Total Power Dissipation
RθJC = Junction to Case Thermal Resistance
RθCS = Case to Heat Sink Thermal Resistance
RθSA = Heat Sink to Ambient Thermal Resistance
TC
= Case Temperature
TA
= Ambient Temperature
TS
= Sink Temperature
Example:
The example demonstrates a worst case analysis for
the op-amp output stage. This occurs when the output
voltage is 1/2 the power supply voltage. Under this con-
dition, maximum power transfer occurs and the output
is under maximum stress.
Conditions:
VCC=±40VDC
VO=±20Vp Sine Wave, Freq.=1KHz
RL=1KΩ
For a worst case analysis we treat the ±20Vp sine wave
as an 8 VDC output voltage.
1.) Find driver power dissipation
PD=(VCC-VO) (VO/RL)
=(40V-20V) (20V/1KΩ)
=400mW
2.) For conservative design, set TJ =+125°C.
3.) For this example, worst case TA =+100°C.
4.) RθJC = 16°C/W.
5.) RθCS=0.15°C/W for most thermal greases.
6.) Rearrange governing equation to solve for RθSA:
RθSA= ((TJ - TA) / PD) - (RθJC) - (RθCS)
= (125°C - 100°C)/0.4W - 16°C/W - 0.15°C/W
=62.5 - 16.15
=46.4°C/W
The heat sink in this example must have a thermal
resistance of no more than 46.4°C/W to maintain a junc-
tion temperature of less than +125°C.
TYPICAL APPLICATION CIRCUIT
REPLACING THE LH0004
The MSK 0004 is not an exact copy of the LM0004
but it is only slightly different. The MSK 0004 is inter-
nally compensated and is lower cost. Pins 1,5,6,7 and
10 are not connected internally in the MSK0004.
POWER SUPPLY BYPASSING
Both the negative and positive power supplies must
be effectively decoupled with a high and low frequency
bypass circuit to avoid power supply induced oscillation.
An effective deecoupling scheme consists of a 0.1
microfarad ceramic capacitor in parallel with a 4.7 mi-
crofarad tantalum capacitor from each power supply pin
to ground.



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