SY88403BL

DS20006650A-page 14

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2022 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.203 REF

1.50

0.35

0.18

0.80

0.00

0.23

0.40

1.55

0.90

0.02

3.00 BSC

MILLIMETERS

MIN

NOM

16

1.60

0.45

0.28

1.00

0.05

MAX

K

0.33 REF

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

1.50

3.00 BSC

1.55

1.60

16-Lead Very Thin Plastic Quad Flat, No Lead Package (NCA) - 3x3x1.0 mm Body [VQFN]

With 1.55 mm Exposed Pad

Microchip Technology Drawing C04-1103-NCA Rev B