DG9409DN datasheet(2/12 Pages) VISHAY

2 / 12 page

DG9408/9409

Vishay Siliconix

New Product

www.vishay.com

Document Number: 71870

S-21060—Rev. A, 05-Aug-02

TRUTH TABLES AND ORDERING INFORMATION

TRUTH TABLE

DG9408

On Switch

None

TRUTH TABLE

DG9409

On Switch

None

X = Don’t Care

For low and high voltage levels for VAX and VEN consult “Digital Control” Parameters for Specific V+ operation. See Specifications

Tables for:

Single Supply 12 V

Dual Supply V+ = 5 V, V- = -5 V

Single Supply 5 V

Single Supply 3 V

ORDERING INFORMATION

DG9408

Temp Range

Package

Part Number

-40 to 85

16-Pin QFN (4x4 mm)

DG9408DN

ORDERING INFORMATION

DG9409

Temp Range

Package

Part Number

-40 to 85

16- Pin QFN (4x4 mm)

DG9409DN

ABSOLUTE MAXIMUM RATINGS

Voltage Referenced to V-

V+

14 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GND

7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Digital Inputsa, VS, VD

(V-) -0.3 V to (V+) +0.3 V

. . . . . . . . . . . . . . . . . . . . . . .

Current (Any Terminal Except S or D)

30 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous Current, S or D)

100 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Peak Current, S or D

(Pulsed at 1 ms, 10% Duty Cycle Max)

200 mA

. . . . . . . . . . . . . . . . . . . . . . . . .

Package Solder Reflow Conditionsd

16-Pin (4x4 mm) QFN

240

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage Temperature

-65 to 150

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Dissipation (Package)b, (TA = 70_C)

16-Pin (4x4 mm) QFNc

1880 mW

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Notes

Signals on SX, DX or INX exceeding V+ or V- will be clamped by internal

diodes. Limit forward diode current to maximum current ratings.

All leads soldered or welded to PC board.

Derate 23.5 mW/

_C above 70_C.

Manual soldering with soldering iron is not recommended for leadless

components. The QFN is a leadless package. The end of the lead

terminal is exposed copper (not plated) as a result of the singulation

process in manufacturing. A solder fillet at the exposed copper lip cannot

be guaranteed and is not required to ensure adequate bottom side solder

interconnection.

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