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4611 Datasheet(PDF) 5 Page - Shenzhen Tuofeng Semiconductor Technology Co

Part # 4611
Description  N and P-Channel Enhancement Mode Power MOSFET
PDF  8 Pages
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Manufacturer  TUOFENG [Shenzhen Tuofeng Semiconductor Technology Co]
Direct Link  http://www.sztuofeng.com/?lang=en
Logo TUOFENG - Shenzhen Tuofeng Semiconductor Technology Co

4611 Datasheet(HTML) 5 Page - Shenzhen Tuofeng Semiconductor Technology Co

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Symbol
Min
Typ
Max
Units
BVDSS
-60
V
-1
IGSS
±100
nA
VGS(th)
-1.5
-1.9
-3
V
ID(ON)
-30
A
Ω
gFS
17.8
S
VSD
-0.73
-1
V
IS
-3
A
Ciss
2417
2900
pF
Coss
179
pF
Crss
120
pF
Rg
1.9
2.3
Ω
Qg(10V)
45.2
55
nC
Qg(4.5V)
22.8
28
nC
Qgs
5.8
nC
Qgd
9.6
nC
tD(on)
9.8
ns
tr
6.1
ns
tD(off)
44
ns
tf
12.7
ns
trr
32
42
ns
Qrr
42
nC
Body Diode Reverse Recovery Time
IF=-4.9A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge IF=-4.9A, dI/dt=100A/µs
Turn-On DelayTime
VGS=-10V, VDS=-30V, RL=6.2Ω,
RGEN=3Ω
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Total Gate Charge (4.5V)
Gate Source Charge
Gate Drain Charge
SWITCHING PARAMETERS
Total Gate Charge (10V)
VGS=-10V, VDS=-30V, ID=-4.9A
Reverse Transfer Capacitance
Gate resistance
DYNAMIC PARAMETERS
Input Capacitance
VGS=0V, VDS=-30V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
Diode Forward Voltage
IS=-1A,VGS=0V
Maximum Body-Diode Continuous Current
Output Capacitance
VDS=-5V, ID=-4.9A
RDS(ON)
Static Drain-Source On-Resistance
Forward Transconductance
VGS=-10V, ID=-4.9A
m
Ω
VGS=-4.5V, ID=-4.4A
Gate Threshold Voltage
VDS=VGS ID=-250µA
On state drain current
VGS=-10V, VDS=-5V
µA
Gate-Body leakage current
VDS=0V, VGS=±20V
Drain-Source Breakdown Voltage
ID=-250µA, VGS=0V
IDSS
Zero Gate Voltage Drain Current
VDS=-48V, VGS=0V
P-Channel Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Conditions
STATIC PARAMETERS
A: The value of R θJA is measured with the device mounted on 1in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A =25°C.
The value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80
µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A=25°C. The
SOA curve provides a single pulse rating.
A: The value of R θJA is measured with the device mounted on 1in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A =25°C.
The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300
µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A=25°C. The
SOA curve provides a single pulse rating.
Rev5: Nov. 2010
60
55
72
68
m
Page
v1.0
5
SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD
SOP-8 Plastic-Encapsulate MOSFETS
4611
www.sztuofeng.com



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