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4611 Datasheet(PDF) 5 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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4611 Datasheet(HTML) 5 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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5 / 8 page ![]() Symbol Min Typ Max Units BVDSS -60 V -1 IGSS ±100 nA VGS(th) -1.5 -1.9 -3 V ID(ON) -30 A Ω gFS 17.8 S VSD -0.73 -1 V IS -3 A Ciss 2417 2900 pF Coss 179 pF Crss 120 pF Rg 1.9 2.3 Ω Qg(10V) 45.2 55 nC Qg(4.5V) 22.8 28 nC Qgs 5.8 nC Qgd 9.6 nC tD(on) 9.8 ns tr 6.1 ns tD(off) 44 ns tf 12.7 ns trr 32 42 ns Qrr 42 nC Body Diode Reverse Recovery Time IF=-4.9A, dI/dt=100A/µs Body Diode Reverse Recovery Charge IF=-4.9A, dI/dt=100A/µs Turn-On DelayTime VGS=-10V, VDS=-30V, RL=6.2Ω, RGEN=3Ω Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time Total Gate Charge (4.5V) Gate Source Charge Gate Drain Charge SWITCHING PARAMETERS Total Gate Charge (10V) VGS=-10V, VDS=-30V, ID=-4.9A Reverse Transfer Capacitance Gate resistance DYNAMIC PARAMETERS Input Capacitance VGS=0V, VDS=-30V, f=1MHz VGS=0V, VDS=0V, f=1MHz Diode Forward Voltage IS=-1A,VGS=0V Maximum Body-Diode Continuous Current Output Capacitance VDS=-5V, ID=-4.9A RDS(ON) Static Drain-Source On-Resistance Forward Transconductance VGS=-10V, ID=-4.9A m Ω VGS=-4.5V, ID=-4.4A Gate Threshold Voltage VDS=VGS ID=-250µA On state drain current VGS=-10V, VDS=-5V µA Gate-Body leakage current VDS=0V, VGS=±20V Drain-Source Breakdown Voltage ID=-250µA, VGS=0V IDSS Zero Gate Voltage Drain Current VDS=-48V, VGS=0V P-Channel Electrical Characteristics (TJ=25°C unless otherwise noted) Parameter Conditions STATIC PARAMETERS A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient. D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve provides a single pulse rating. A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient. D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300 µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve provides a single pulse rating. Rev5: Nov. 2010 60 55 72 68 m Page v1.0 5 SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD SOP-8 Plastic-Encapsulate MOSFETS 4611 www.sztuofeng.com |
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