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TF25115 Datasheet(PDF) 2 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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TF25115 Datasheet(HTML) 2 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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2 / 6 page ![]() 2 Page Electrical Characteristics (TC=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BVDSS VGS=0V ID=250μA Zero Gate Voltage Drain Current IDSS VDS=25V,VGS=0V - - 1 μA Gate-Body Leakage Current IGSS VGS=±12V,VDS=0V - - ±100 nA On Characteristics (Note 3) Gate Threshold Voltage VGS(th) VDS=VGS,ID=250μ 0.5 VGS=4.5V, ID 2.4 Drain-Source On-State Resistance RDS(ON) VGS=2.5V, ID=20A mΩ Forward Transconductance gFS VDS=5V,ID=20A Dynamic Characteristics (Note4) Input Capacitance Clss Output Capacitance Coss Reverse Transfer Capacitance Crss VDS=15V,VGS=0V, F=1.0MHz Switching Characteristics (Note 4) Turn-on Delay Time td(on) Turn-on Rise Time tr Turn-Off Delay Time td(off) Turn-Off Fall Time tf VDD=10V,ID=20A VGS=4.5V,RGEN=3.0Ω Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd VDS=10V,ID=20A, VGS=4.5V Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VSD VGS=0V,IS=20A Diode Forward Current (Note 2) IS Reverse Recovery Time trr Reverse Recovery Charge Qrr TJ = 25°C, IF = 20A di/dt = 100A/μs (Note3) Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production 5. EAS condition:Tj=25℃,VDD=15V,VG=10V,L=0.5mH,Rg=25Ω SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD PDFN 3333 Plastic-Encapsulate MOSFETS =20A 3.0 - 3.2 4.0 - www.sztuofeng.com Jun 2020 V1.0 A V 0.75 1.2 S - - 20 V - - 1.2 A - - 115 PF - - 3611 PF - - 1865 PF - - 73 nS - - 9 nS - - 35 nS - - 5 nS - - 15 nC - - 5.6 nC - - 6.5 nC - - 28.1 nS - - 24 uC - - 30 TF25115 V - - 25 |
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