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CC2640R2F Datasheet(PDF) 48 Page - Texas Instruments

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Part # CC2640R2F
Description  CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU
PDF  54 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CC2640R2F Datasheet(HTML) 48 Page - Texas Instruments

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Technical Reference Manual (TRM)
CC13x2, CC26x2 SimpleLink™
Wireless MCU TRM
SPACER
The TRM provides a detailed description of all modules and
peripherals available in the device family.
11.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.5 Trademarks
LaunchPad™, EnergyTrace™, Code Composer Studio™, and TI E2E™ are trademarks of Texas Instruments.
I-jet™ is a trademark of IAR Systems AB.
J-Link™ is a trademark of SEGGER Microcontroller Systeme GmbH.
Arm® and Cortex® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
CoreMark® is a registered trademark of Embedded Microprocessor Benchmark Consortium Corporation.
Wi-Fi® is a registered trademark of Wi-Fi Alliance.
Arm Thumb® is a registered trademark of Arm Limited (or its subsidiaries).
Eclipse® is a registered trademark of Eclipse Foundation.
IAR Embedded Workbench® is a registered trademark of IAR Systems AB.
Windows® is a registered trademark of Microsoft Corporation.
All trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.7 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
CC2642R-Q1
SWRS229B – JANUARY 2020 – REVISED JUNE 2022
www.ti.com
48
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: CC2642R-Q1



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