HS401x Datasheet

R36DS0023EU0103 Rev.1.03

Jun 6, 2022

Page 22

Figure 25. Recommended Soldering Profile

It is important to ensure this temperature profile is measured at the sensor itself. Measuring the profile at a larger

component with a higher thermal mass means the temperature at the small sensor will be higher than expected.

For manual soldering, the contact time must be limited to 5 seconds with a maximum iron temperature of 350°C.

In either case, a board wash after soldering is not recommended. Therefore, if a solder paste is used, it is

strongly recommended that a “no-clean” solder paste is used to avoid the need to wash the PCB.

After soldering, the recommended rehydration process should be done. Otherwise, there may be an initial offset

in the relative humidity readings, which will slowly disappear as the sensor get exposed to ambient conditions.

Recommended rehydration process:

or