HS401x Datasheet

R36DS0023EU0103 Rev.1.03

Jun 6, 2022

Page 23

7.

PCB Layout Guide

When designing the PCB, undesired heat transfer paths to the HS401x series must be minimized. Excessive

heat from other components on the PCB will result in inaccurate temperature and relative humidity

measurements. As such, solid metal planes for power supplies should be avoided in the vicinity of the

sensor since these will act as thermal conductors. To further reduce the heat transfer from other components on

the board, openings can be milled into the PCB as shown in Figure 26.

Figure 26. Milled PCB Openings for Thermal Isolation

8.

Storage and Handling

Recommendation: Once the sensors are removed from their original packaging, store them in metal-in antistatic

bags.

Avoid using polyethylene antistatic bags as they may affect sensor accuracy.

The nominal storage conditions are 10 to 50°C and humidity levels within 20% to 60%RH. If stored outside of

these conditions for extended periods of time, the sensor readings may exhibit an offset. The sensor can be

reconditioned and brought back to its calibration state by applying the following procedure:

1.

Bake at a temperature of 100°C with a humidity < 10%RH for 10 to 12 hours.

2.

Rehydrate the sensor at a humidity of 75%RH and a temperature between 20 to 30°C for 12 to 14 hours.

9.

Quality and Reliability

The HS401x series is available as a qualified product for consumer and industrial market applications. All data

specified parameters are guaranteed if not stated otherwise.

Milled Opening

Milled Opening