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PSS Datasheet(PDF) 1 Page - Vishay Siliconix |
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PSS Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 4 page ![]() PSS www.vishay.com Vishay Electro-Films Revision: 26-Sep-2018 1 Document Number: 61111 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Custom Substrates - Conductor Resistor Pattern and Overcoat FEATURES • Precision conductor and resistor patterns • TaN and NiCr resistor films • Resistor tolerance down to 0.1 % • Silicon nitirde, and polyimide overcoat coatings • Metallization on 1 or 2 surfaces • Various substrate materials • Sputtered / plated metal systems • Custom sizes from 0.020" x 0.020" to 4.000" x 4.000" • Quick delivery available APPLICATIONS Vishay EFI conductor resistor patterned substrates with optional overcoat coatings are used in the hybrid circuit, microwave, and telecommunications industries. These conductor resistor patterns are precisely manufactured to be used for precision current flow, voltage division and RF / Microwave designs. Resistor overcoat options are used for resistor protection and can be applied and patterned to match the conductor and / or resistor pattern. The conductor resistor patterned substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The custom specialty film substrates are visually inspected to MIL-STD-883, method 2032 class H or K. THIN FILM DESIGN GUIDELINES For further detail, please reference document: Thin Film Design Guide for RF and UWave Substrates (www.vishay.com/doc?49109). SUBSTRATE MATERIALS For substrate materials and their properties, please reference datasheet: SPF1 (www.vishay.com/doc?61105). METAL SYSTEM AND CONDUCTOR PATTERNING For metal system options and metal patterning guidelines, please reference datasheet: SPF2 (www.vishay.com/doc?61110). INTEGRATING THIN FILM RESISTORS Vishay EFI offers two thin film resistor film choices of lithographically patterned Tantalum Nitride (TaN) or Nickel Chromium (NiCr). The resistive film should be selected based upon application-specific requirements such as performance, assembly packaging needs, and temperature exposure. The table below summarizes the key standard parameters of these resistor materials. Notes (1) 1000 h at 125 ºC in air (2) Special tolerances available STANDARD THIN FILM RESISTOR PARAMETERS MATERIAL TCR (ppm/°C) STANDARD SHEET RESISTIVITY 99.6 % Al2O3 ( /sq) STANDARD SHEET RESISTIVITY AIN, BeO ( /sq) STABILITY (1) TOLERANCE (2) TaN ± 50 20 to 125 25 to 100 < 0.1 % 0.1 % to 20 % NiCr ± 25 25 to 225 50 to 150 < 0.1 % 0.1 % to 20 % |
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