Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-988.650

1160.250

16

1027.050

-1056.650

2

-988.650

1047.250

17

1027.050

-945.550

3

-988.650

934.800

18

1027.050

-845.550

4

-988.650

786.150

19

1010.150

1156.650

5

-1027.075

127.300

20

910.150

1156.650

6

-1027.050

-550.500

21

799.550

1156.650

7

-1027.050

-655.900

22

699.550

1156.650

8

-1006.750

-768.100

23

588.950

1156.650

9

285.550

-1156.650

24

488.950

1156.650

10

387.350

-1156.650

25

378.350

1156.650

11

497.950

-1156.650

26

278.350

1156.650

12

597.950

-1156.650

27

167.750

1156.650

13

708.550

-1156.650

28

67.750

1156.650

14

808.550

-1156.650

29

-42.850

1156.650

15

1027.050

-1156.650

Pad Description

Pad No.

Pad Name

I/O

Internal

Connection

Function

8, 7

VDD, VSS

¾¾

Digital power supply, ground

3,4

VDDA, VSSA

¾¾

DAC power supply

14~21

PA0~PA7

I/O

Wake-up,

Pull-high or

None

Bidirectional 8-bit I/O port, wake-up by mask option

29~22

PB0~PB7

I/O

Pull-high or

None

Bidirectional 8-bit I/O port

13~10

PC0~PC3

I/O

Pull-high or

None

Bidirectional 4-bit I/O port

9

RESET

I

¾

Reset input, active low

6

OSC1

I

X

¢tal/Resistor XIN for X¢tal or ROSCIN for resistor by mask option

5

OSC2

O

¾

XOUT or T1

1

RCH

O

¾

DAC output R channel

2

LCH

O

¾

DAC output L channel

Note: In the form pin number value is for the 32 SOP type MCU.

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT36F6

Rev. 1.00

3

August 15, 2005