MS5534 datasheet(19/21 Pages) ETC1

19 / 21 page

DA5534_022.doc

July 17th, 2002

ECN493

Mechanical Stress

It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the

PCB should be not below 1.6mm. A thicker PCB is more stiff creating less stress on the soldering contacts. For

applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin

PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401) at the

corners of the sensor as shown below.

Fixing with Globtop

increases mechanical

stability

Mounting

The MS5534A can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be

damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.

Special care has to be taken to not touch the protective gel of the sensor during the assembly.

The MS5534A can be mounted with the cap down or the cap looking upwards. In both cases it is important to

solder all contact pads. The Pins PEN and PV shall be left open or connected to Vdd.

DO NOT CONNECT TO GND !

Placement Cap down

(hole in PCB to fit cap)

Solder at both sides to

increase mechanical

stability

Placement Cap up (rectangular

hole in PCB to fit Globtop)

Sealing with O-Ring

In products like outdoor watches the electronics must be protected against direct water or humidity. For those

products the MS5534-AM provides the possibility to seal with an O-Ring. The protective cap of the MS5534-AM

is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5534-AM is

filled with silicone gel covering the sensor and the bonding wires. The O-Ring (or O-Rings) shall be placed at the

outer diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical

direction.

MS5534 Datasheet(PDF) 19 Page - List of Unclassifed Manufacturers