Rev Date: 10/22/2020

2

www.seielect.com

This specification may be changed at any time without prior notice.

marketing@seielect.com

Please confirm technical specifications before you order and/or use.

HCC Series

High Current Chassis Mount Shunt Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Power Derating Curve:

Recommended Solder Profile

This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should

be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board

density, geometry, packages used, etc., especially those cells labeled with “*”.

100% Matte Tin / RoHS Compliant Terminations

Soldering iron recommended temperatures: 330°C to 350°C with minimum duration.

Maximum number of reflow cycles: 3.

Environmental Performance Characteristics (cont.)

Wave Soldering

Item

Test Condition

Specification

Note: The surface temperature of component should be below 100ºC.

Storage Conditions: 22ºC ~ 28ºC. Humidity: 40 ~ 75%

Operating temperature range is -55°C to +170°C

Rapid Change of

Temperature

The part (mounted on board) is exposed, -55ºC ± 3ºC (30 minutes)/

+125ºC ± 2ºC (30 minutes) for 5 cycles. The following conditions

are as the figure below. (JIS_C5202-7.4)

ΔR: ± (1% + 0.0005 Ω)

Description

Maximum

Recommended

Minimum

Preheat Time

80 seconds

70 seconds

60 seconds

Temperature Diff.

140°C

120°C

100°C

Solder Temp.

260°C

250°C

240°C

Dwell Time at Max.

10 seconds

5 seconds

*

Ramp DN (°C/sec)

N/A

N/A

N/A

Temperature Diff. = Difference between final preheat stage and soldering stage.