Rev Date: 9/12/2022

4

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Please confirm technical specifications before you order and/or use.

HCSK Series

Kelvin Termination Metal Element Current Shunt Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Taping Specifications

– Embossed Plastic Tape

Function Performance Characteristics

Test

Test Method

Test Specification

Test Condition

Mount the chip to test 90 mm (L) * 40 mm (W) FR4 printed circuit board substrate.

Apply pressure in direction of arrow unit band width reaches 2 mm (+0.2 / -0 mm)

illustrated in the figure below and hold for 10 ± 1 seconds.

Bending Strength

JIS-C5202-6.1

Δ R: ± 1%

JIS-C5202-6.11

Solder shall cover

95% or more of

the electrode

area.

Solderability

The part shall be immersed into the flux specified in the solder bath

235ºC ± 5ºC for 2 seconds ± 0.5 seconds.

It shall be immersed to a point 10 mm from its root.

(Sn96.5/Ag3.0/Cu0.5)

Type/Code

Unit

0.130 ± 0.004

0.165 ± 0.004

0.104 ± 0.004

0.217 ± 0.004

0.472 ± 0.008

inches

3.30 ± 0.10

4.20 ± 0.10

2.64 ± 0.10

5.50 ± 0.10

12.00 ± 0.20

mm

Unit

0.157 ± 0.004

0.315 ± 0.004

0.079 ± 0.002

0.059 ± 0.004

0.083 ± 0.004

inches

4.00 ± 0.10

8.00 ± 0.10

2.00 ± 0.05

1.50 ± 0.10

2.10 ± 0.10

mm

Type/Code

Unit

0.276 ± 0.004

0.276 ± 0.004

0.069 ± 0.004

0.295 ± 0.004

0.630 ± 0.008

inches

7.00 ± 0.10

7.00 ± 0.10

1.75 ± 0.10

7.50 ± 0.10

16.00 ± 0.20

mm

Unit

0.157 ± 0.004

0.472 ± 0.004

0.079 ± 0.004

0.059 ± 0.004

0.122 ± 0.004

inches

4.00 ± 0.10

12.00 ± 0.10

2.00 ± 0.10

1.50 ± 0.10

3.10 ± 0.10

mm

D0

W

W

A

B

E

F

T

HCSK1216

HCSK2725

A

B

E

F

P0

P1

P2

D0

T

P0

P1

P2