STA335BWSQS datasheet(64/70 Pages) STMICROELECTRONICS

64 / 70 page

Package thermal characteristics

STA335BWSQS

64/70

Package thermal characteristics

Using a double-layer PCB the thermal resistance (junction to ambient) with two copper

ground areas of 3 x 3 cm2 and with 16 via holes (see Figure 20) is 24° C/W in natural air

convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

The estimated maximum dissipated power for the STA335BWSQS is:

Figure 20.

Double-layer PCB with copper ground area and 16 via holes

Figure 21 shows the power derating curves for the PowerSSO-36 package on a board with

two different sizes of copper layers.

Figure 21.

PowerSSO-36 power derating curves

8.1

Thermal data

2 x 20 W into 8

Ω at 18 V

Pd max ~ 4 W

2 x 10 W + 1 x 20 W into 4

Ω, 8 Ω at 18 V Pd max < 5 W

100

120

140

160

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA335BW

PSSO36

Copper Area 3x3 cm

and via holes

STA335BWSQS

PowerSSO-36

Table 72.

Thermal data

Parameter

Min

Typ

Max

Unit

Rth j-case

Thermal resistance junction-case (thermal

pad)

1.5

°C/W

Tth-sdj

Thermal shut-down junction temperature

150

°C

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