ARF466FL

APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522

5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 and foreign patents. US and Foreign patents pending. All Rights Reserved.

Thermal Considerations and Package Mounting:

The rated power dissipation is only available when the

package mounting surface is at 25°C and the junction tem-

perature is 175°C. The thermal resistance between junc-

tions and case mounting surface is 0.3°C/W. When instal-

led, an additional thermal impedance of 0.1°C/W between

the package base and the mounting surface is typical. In-

sure that the mounting surface is smooth and flat. Thermal

joint compound must be used to reduce the effects of small

surface irregularities. Use the minimum amount necessary

to coat the surface. The heatsink should incorporate a cop-

per heat spreader to obtain best results.

The package design clamps the ceramic base to the

heatsink. A clamped joint maintains the required mounting

pressure while allowing for thermal expansion of both the

base and the heat sink. Four 4-40 (M3) screws provide

the required mounting force. Torque the mounting screws

to 6 in-lb (0.68 N-m).

.330

.210

.210

.375

.570

ARF466FL

1.500

.300

.200

.005

.040

.320

1.250

.125R

4 pls

.125dia

4 pls

T3 Package Outline

D

S

S

S

S

G

L1

C1

R1

R3

R4

R5

ARF466FL

L2

L3

C3

C4

C7

C6

R2

C2

C8

C9

L4

150V

+

-

RF

Output

RF

Input

40.68 MHz Test Circuit

+

-

Bias

0-12V

C5

TL1

C1 -- 2200pF ATC 700B

C2-C5 -- Arco 465 Mica trimmer

C6-C8 -- .1mF 500V ceramic chip

C9 -- 3x 2200pF 500V chips COG

L1 -- 3t #22 AWG .25"ID .25 "L ~55nH

L2 -- 5t #16 AWG .312" ID .35"L ~176nH

L3 -- 10t #24 AWG .25"ID ~.5uH

L4 -- VK200-4B ferrite choke 3uH

R1- R3 -- 1k

Ω 0.5W

R4- R5 -- 1

Ω 1W SMT

TL1 -- 40

Ω t-line 0.15 x 2"

C1 is ~1.75" from R4-5.