Mechanical Drawing

26.0-40.0 GHz GaAs MMIC

Power Amplifier

Bias Arrangement

(Note: Engineering designator is 38PAMP_07B)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.482 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vg1)

Bond Pad #3 (Vd1)

Bond Pad #4 (Vg2)

Bond Pad #5 (Vd2)

Bond Pad #6 (RF Out)

Bond Pad #7 (V2 Out)

Bond Pad #8 (Vd5)

Bond Pad #9 (V1 Out)

Bond Pad #10 (Vd4)

Bond Pad #11 (Vg4)

Bond Pad #12 (Vd3)

Bond Pad #13 (Vg3)

Page 3 of 6

Bypass Capacitors - See App Note [3]

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2004 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

P1001

RF In

RF Out

Vg1,2

Vd1,2

Vg3,4 Vd3,4 V1 Out

Vd5

V2 Out

XP1001

2.500

(0.098)

1

2

3

4

5

6

7

8

9

10

11

12

13

0.516

(0.020)

0.914

(0.036)

1.313

(0.052)

1.915

(0.075)

1.910

(0.075)

3.540

(0.139)

3.414

(0.134)

3.213

(0.127)

3.012

(0.119)

1.915

(0.075)

1.313

(0.052)

0.914

(0.036)

0.516

(0.020)

0.0

0.0

0.945

(0.037)

1

2

3

4

5

6

7

8

9

10

11

12

13

Vg1,2

Vd1,2

RF Out

RF In

Vg3,4

Vd3,4

V2 Out

Rd

Vd5

V1 Out

May 2005 - Rev 05-May-05