Package information

ESDALC6V1M3

6/8

Figure 13.

ST Ecopack® recommended soldering reflow profile for PCB mounting

Figure 14.

Packing information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

Cathode bar

User direction of unreeling

All dimensions in mm

4.0 ± 0.1

2.0 ± 0.05

4.0 ± 0.1

Ø 1.5 ± 0.1

0.66 ± 0.05

0.68 ± 0.05