IRF6655

www.irf.com

3

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

back and with small clip heatsink.

Notes:

† Surface mounted on 1 in. square Cu

board (still air).

ˆ Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)

‡ Mounted to a PCB with a

thin gap filler and heat sink.

(still air)

1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

t1 , Rectangular Pulse Duration (sec)

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

Absolute Maximum Ratings

Parameter

Units

Power Dissipation

h

W

Power Dissipation

h

Power Dissipation

k

Peak Soldering Temperature

°C

Operating Junction and

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Ambient

hl

–––

58

Junction-to-Ambient

il

12.5

–––

Junction-to-Ambient

jl

20

–––

°C/W

Junction-to-Case

kl

–––

3.0

Junction-to-PCB Mounted

1.4

–––

2.2

1.4

270

-40 to + 150

Max.

42

Ri (°C/W)

τi (sec)

1.6195

0.000126

2.1406

0.001354

22.2887

0.375850

20.0457

7.410000

11.9144

99

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

Ci=

τi/Ri

Ci=

τi/Ri

τ

4

τ

4

R

4

R

4

τ

A

τ

A

τ

5

τ

5

R

5

R

5