LSF0102 datasheet(8/53 Pages) TI

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6.5 Thermal Information

THERMAL METRIC(1)

LSF0102

UNIT

DCU (US8)

DCT (SM8)

DQE (X2SON)

YZT (DSBGA)

DDF (SOT-23)

8 PINS

RθJA

Junction-to-ambient thermal resistance

210.1

189.6

246.5

125.5

243.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

89.1

119.6

149.1

1.0

168.7

°C/W

RθJB

Junction-to-board thermal resistance

88.8

102.1

100.0

62.7

157.6

°C/W

ψJT

Junction-to-top characterization parameter

8.3

44.5

17.1

3.4

45.9

°C/W

ψJB

Junction-to-board characterization

parameter

88.4

101.0

99.8

62.7

157.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.6 Thermal Information

THERMAL METRIC(1)

LSF0108

UNIT

RKS (VQFN)

PW (TSSOP)

DGS (VSSOP)

20 PINS

RθJA

Junction-to-ambient thermal resistance

49.3

106.6

123.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

45.9

41.0

62.2

°C/W

RθJB

Junction-to-board thermal resistance

20.6

57.6

77.4

°C/W

ψJT

Junction-to-top characterization parameter

2.5

4.2

8.8

°C/W

ψJB

Junction-to-board characterization parameter

20.6

47.0

77.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.4

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

LSF0108

SDLS966L – DECEMBER 2013 – REVISED DECEMBER 2022

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