6.4 ESD Ratings - ISO Specification

DEVICE

VALUE

UNIT

V(ESD) Electrostatic discharge

Contact discharge

ISO 10605, 150-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

V

ESD751-Q1

± 22000

ESD761-Q1

± 15000

ISO 10605, 330-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

ESD751-Q1

± 22000

ESD761-Q1

± 15000

Air-gap discharge

ISO 10605, 150-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

ESD751-Q1

± 22000

ESD761-Q1

± 15000

ISO 10605, 330-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

ESD751-Q1

± 22000

ESD761-Q1

± 15000

6.5 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

-24

24

V

TA

Operating free-air temperature

-55

150

°C

6.6 Thermal Information

THERMAL METRIC(1)

ESD1LIN24-Q1

ESD751-Q1

ESD761-Q1

UNIT

DYF (SOD-323)

DYA (SOD-523)

DPY (X1SON)

2 PINS

2 PINS

2 PINS

RθJA

Junction-to-ambient thermal resistance

705.4

746.3

282.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

315

301.2

150.6

°C/W

RθJB

Junction-to-board thermal resistance

561.5

509.6

98.3

°C/W

ΨJT

Junction-to-top characterization parameter

145

81.8

9.6

°C/W

ΨJB

Junction-to-board characterization parameter

550.2

503.0

97.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.7 Electrical Characteristics

over TA = 25°C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

DEVICE

MIN

TYP

MAX

UNIT

VRWM

Reverse stand-off voltage

–24

24

V

VBRF

Breakdown voltage(1)

IIO = 10 mA, IO to GND

25.5

35.5

V

VBRR

Breakdown voltage(1)

IIO = –10 mA, IO to GND

–35.5

–25.5

V

VCLAMP

Clamping voltage(2)

IPP = 4.3 A, tp = 8/20 µs, IO to GND and

GND to IO

ESD1LIN24-Q1

37

V

IPP = 2.8 A, tp = 8/20 µs, IO to GND and

GND to IO

ESD751-Q1

36.5

IPP = 1.8 A, tp = 8/20 µs, IO to GND and

GND to IO

ESD761-Q1

36.3

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ESD1LIN24-Q1, ESD751-Q1, ESD761-Q1

SLVSGS4C – SEPTEMBER 2022 – REVISED DECEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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