AP61300/AP61302

Document number: DS43404 Rev. 3 - 2

18 of 21

www.diodes.com

November 2022

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AP61300/AP61302

Layout

PCB Layout

1.

The AP61300/AP61302 works at 3A load current so heat dissipation is a major concern in the layout of the PCB. 2oz copper for both the top

and bottom layers is recommended.

2.

Place the input capacitors as closely across VIN and GND as possible.

3.

Place the inductor as close to SW as possible.

4.

Place the output capacitors as close to GND as possible.

5.

Place the feedback components as close to FB as possible.

6.

If using four or more layers, use at least the 2nd and 3rd layers as GND to maximize thermal performance.

7.

Add as many vias as possible around both the GND pin and under the GND plane for heat dissipation to all the GND layers.

8.

Add as many vias as possible around both the VIN pin and under the VIN plane for heat dissipation to all the VIN layers.

9.

See Figure 42 and Figure 43 for more details.

FB

GND

VIN

SW

EN

OUT

R1

R2

C2

VIN

VOUT

SW

GND

C3

FB

GND

VIN

SW

EN

PG

R1

R2

C2

VIN

VOUT

SW

GND

Figure 42. Recommended AP61300 PCB Layout

Figure 43. Recommended AP61302 PCB Layout