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LCS702LG Datasheet(PDF) 6 Page - Power Integrations, Inc.

Part # LCS702LG
Description  Integrated LLC Controller, High-Voltage Power MOSFETs and Drivers
PDF  30 Pages
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Manufacturer  POWERINT [Power Integrations, Inc.]
Direct Link  http://www.powerint.com
Logo POWERINT - Power Integrations, Inc.

LCS702LG Datasheet(HTML) 6 Page - Power Integrations, Inc.

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Rev. G 05/17
6
LCS700-708
www.power.com
Basic Layout Guidelines
The HiperLCS is a high-frequency power device and requires careful
attention to circuit board layout in order to achieve maximum
performance.
The bypass capacitors need to be positioned and laid out carefully to
minimize trace lengths to the pins they serve. SMD components are
recommended for minimum component and trace stray inductance.
Table 2 describes the recommended bypass capacitor values for pins
that require filtering/bypassing. The table lists the pins in the order
of most to least sensitive. The bypass capacitor of the pin at the top
of the list being the most sensitive, receives higher priority in bypass
capacitor positioning to minimize trace lengths, than the bypass
capacitor of the pin below it. Noise entering the two most sensitive
pins on the list, namely the FEEDBACK and DT/BF pins, will cause
duty cycle, and dead-time imbalance, respectively.
Figure 5 and Figure 6 show two alternate schemes for routing ground
traces for optimum performance. Figure 5 shows a layout footprint
for the LCS with oval pads. These allow a trace to be passed between
pins 3 and 5, directly connecting the ground systems for the bypass
capacitors located on each side of the IC.
Figure 6 shows an LCS layout footprint with round pads that do not
allow traces to be routed between them due to insufficient space. In
this case, a jumper (JP1, a 1206 size 0 W resistor) is used to connect
the ground systems together and allow a connection for pin 3 to be
routed under JP1 to the optocoupler.
Transformer T1 is a source of both high di/dt signals and dv/dt noise.
The first can couple magnetically to sensitive circuitry, while the
second can inject noise via electrostatic coupling. Electrostatic noise
coupling can be reduced by grounding the transformer core, but it is
not economically feasible to reduce the stray magnetic field around
the transformer without drastically reducing its efficiency. Sensitive
traces and components (such as the optocoupler) should be located
away from the transformer to avoid noise pickup.
Pin
Returned to Pin
Recommended Value
Notes
FEEDBACK (FB)
GROUND
4.7 nF (at 250 kHz)
Increase value proportionally for lower nominal frequency
(e.g. 10 nF at 100 kHz). Forms a pole with FEEDBACK pin
input impedance which is part of feedback loop characteris-
tic. Must not introduce excessive phase shift at expected
gain crossover frequency. Noise entering FEEDBACK pin will
cause duty cycle imbalance.
DEAD-TIME/BURST
FREQUENCY (DT/BF)
GROUND
4.7 nF
Time constant of this capacitor and the source impedance
of the resistors connected to DT/BF pin must be <100 ms.
Noise entering DT/BF pin will cause dead time imbalance.
CURRENT SENSE (IS)
GROUND
1 nF (at 250 kHz)
Value changes proportionally with nominal LLC stage
operating frequency. Forms an RC low pass filter with
recommended 220 W series resistor. Must not attenuate AC
signal of primary current sense.
VCC
GROUND
1 mF ceramic
VREF
GROUND
1 mF ceramic
VCCH
HB
0.1 mF - 0.47 mF
Bootstrap capacitor. Provides instantaneous current for
high-side driver for turning on high-side MOSFET. Time
constant formed with boost-strap current limiting resistor
(in series with bootstrap diode), delays VCCH UVLO for a
few switching cycles at start-up and during burst mode
operation for the first switching cycles
DRAIN
(DC Bus)
S1, S2
10-22 nF SMD ceramic
minimum, plus 22-100 nF
through-hole
Total of 22 nF per amp of nominal primary RMS current. SMD
part must be located directly at the IC and connected close,
with short traces. This prevents ringing of D-S during
hard-switching (loss of ZVS) transients. It also reduces
high-frequency EMI.
OV/UV
GROUND
4.7 nF
Table 2.
Bypass Capacitor Table in Order of Importance.



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