Rev: 1.01 7/2001

21/23

© 2000, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS81032AT/Q-150/138/133/117/100/66

TQFP and QFP Package Drawing

E1

E

b

e

c

L

L1

A2

A1

θ

Notes:

1. All dimensions are in millimeters (mm).

2. Package width and length do not include mold protrusion

Symbol

Description

TQFP

QFP

Min.

Nom.

Max

Min.

Nom.

Max

A1

Standoff

0.05

0.10

0.15

0.25

0.35

0.45

A2

Body Thickness

1.35

1.40

1.45

2.55

2.72

2.90

b

Lead Width

0.20

0.30

0.40

0.20

0.30

0.40

c

Lead Thickness

0.09

—

0.20

0.10

0.15

0.20

D

Terminal Dimension

21.9

22.0

22.1

22.95

23.2

23.45

D1

Package Body

19.9

20.0

20.1

19.9

20.0

20.1

E

Terminal Dimension

15.9

16.0

16.1

17.0

17.2

17.4

E1

Package Body

13.9

14.0

14.1

13.9

14.0

14.1

e

Lead Pitch

—

0.65

—

—

0.65

—

L

Foot Length

0.45

0.60

0.75

.60

0.80

1.00

L1

Lead Length

—

1.00

—

—

1.60

—

Y

Coplanarity

—

—

0.10

—

—

0.10

θ

Lead Angle

0

°

—

7

°

0

°

—

7

°