HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HJ200101

Issued Date : 2001.09.01

Revised Date : 2005.07.14

Page No. : 3/4

HSB857J

HSMC Product Specification

TO-252 Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

M

N

A

a2

a5

L

C

3

2

1

a1

G

H

F

a1

A

B

C

D

a1

E

J

K

a2

a2

L

F

G

H

I

y2

y2

a1

M

y1

a1

O

N

y1

y1

3-Lead TO-252 Plastic

Surface Mount Package

HSMC Package Code: J

Marking:

Control Code

Date Code

HJ

SB

Pb Free Mark

Pb-Free: "

Normal: None

857

Note: Green label is used for pb-free packing

Pin Style: 1.Base 2.Collector 3.Emitter

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

6.35

6.80

C

4.80

5.50

F

1.30

1.70

G

5.40

6.25

H

2.20

3.00

L

0.40

0.90

M

2.20

2.40

N

0.90

1.50

a1

0.40

0.65

a2

-

*2.30

a5

0.65

1.05

*: Typical, Unit: mm

Marking:

HJ

Pb Free Mark

Pb-Free: "

Normal: None

Control Code

Date Code

S B 857

Note: Green label is used for pb-free packing

Pin Style: 1.Base 2.Collector 3.Emitter

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-252 Plastic

Surface Mount Package

HSMC Package Code: J

DIM

Min.

Max.

A

6.40

6.80

B

-

6.00

C

5.04

5.64

D-

*4.34

E

0.40

0.80

F

0.50

0.90

G

5.90

6.30

H

2.50

2.90

I

9.20

9.80

J

0.60

1.00

K

-

0.96

L

0.66

0.86

M

2.20

2.40

N

0.70

1.10

O

0.82

1.22

a1

0.40

0.60

a2

2.10

2.50

y1

-

y2

-

*: Typical, Unit: mm