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LM3489 Datasheet(PDF) 13 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LM3489
Description  Hysteretic PFET Buck Controller with Enable Pin
PDF  15 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3489 Datasheet(HTML) 13 Page - National Semiconductor (TI)

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Design Information (Continued)
INPUT CAPACITOR SELECTION (C
IN)
A bypass capacitor is required between the input source and
ground. It must be located near the source pin of the external
PFET. The input capacitor prevents large voltage transients
at the input and provides the instantaneous current when the
PFET turns on.
The important parameters for the input capacitor are the
voltage rating and the RMS current rating. Follow the manu-
facturer’s recommended voltage derating. For high input
voltage applications, low ESR electrolytic, Nichicon "UD"
series or the Panasonic "FK" series are available. The RMS
current in the input capacitor can be calculated as follows:
The input capacitor power dissipation can be calculated as
follows.
P
D(CIN) =IRMS_CIN
2 x ESR
CIN
The input capacitor must be able to handle the RMS current
and the dissipation. Several input capacitors may be con-
nected in parallel to handle large RMS currents. In some
cases it may be much cheaper to use multiple electrolytic
capacitors than a single low ESR, high performance capaci-
tor such as OS-CON or Tantalum. The capacitance value
should be selected such that the ripple voltage created by
the switch current pulses is less than 10% of the total DC
voltage across the capacitor.
For high VIN conditions (> 28V), the fast switching, high
swing of the internal gate drive introduces unwanted distur-
bance to the VIN rail and the current limit function can be
affected. In order to eliminate this potential problem, a high
quality ceramic capacitor of 0.1 µF is recommended to filter
out the internal disturbance at the VIN pin. This capacitor
should be placed right next to the VIN pin for best perfor-
mance.
PROGRAMMING THE CURRENT LIMIT (R
ADJ)
The current limit is determined by connecting a resistor
(R
ADJ) between input voltage and the ADJ pin, pin 5.
where:
R
DSON : Drain-Source ON resistance of the external PFET
I
CL_ADJ : 3.0µA minimum
I
IND_PEAK =ILOAD +IRIPPLE/2
Using the minimum value for I
CL_ADJ (3.0µA) ensures that
the current limit threshold will be set higher than the peak
inductor current.
The R
ADJ value must be selected to ensure that the voltage
at the ADJ pin does not fall below 3.5V. With this in mind,
R
ADJ_MAX =(VIN-3.5)/7µA. If a larger RADJ value is needed
to set the desired current limit, either use a PFET with a
lower R
DSON, or use a current sense resistor as shown in
Figure 5.
The current limit function can be disabled by connecting the
ADJ pin to ground and ISENSE to VIN.
CATCH DIODE SELECTION (D1)
The important parameters for the catch diode are the peak
current, the peak reverse voltage, and the average power
dissipation. The average current through the diode can be
calculated as following.
I
D_AVE =IOUT x(1−D)
The off state voltage across the catch diode is approximately
equal to the input voltage. The peak reverse voltage rating
must be greater than input voltage. In nearly all cases a
Schottky diode is recommended. In low output voltage ap-
plications a low forward voltage provides improved effi-
ciency. For high temperature applications, diode leakage
current may become significant and require a higher reverse
voltage rating to achieve acceptable performance.
P-CHANNEL MOSFET SELECTION (Q1)
The important parameters for the PFET are the maximum
Drain-Source voltage (V
DS), the on resistance (RDSON), Cur-
rent rating, and the input capacitance.
The voltage across the PFET when it is turned off is equal to
the sum of the input voltage and the diode forward voltage.
The V
DS must be selected to provide some margin beyond
the input voltage.
PFET drain current, Id, must be rated higher than the peak
inductor current, I
IND-PEAK.
Depending on operating conditions, the PGATE voltage may
fall as low as V
IN - 8.3V. Therefore, a PFET must be selected
with a V
GS
maximum rating greater than the maximum
PGATE swing voltage.
As input voltage desreases below 9V, PGATE swing voltage
may also decrease. At 5.0V input the PGATE will swing from
V
IN to VIN - 4.6V. To ensure that the PFET turns on quickly
and completely, a low threshold PFET should be used when
the input voltage is less than 7V.
Total power loss in the FET can be approximated using the
following equation:
PD
switch =RDSON xIOUT
2xD+FxI
OUT xVIN x(ton +toff)/2
where:
t
on = FET turn on time
t
off = FET turn off time
A value of 10ns to 20ns is typical for ton and toff.
A PFET should be selected with a turn on rise time of less
than 100ns. Slower rise times will degrade efficiency, can
cause false current limiting, and in extreme cases may
cause abnormal spiking at the PGATE pin.
The R
DSON is used in determining the current limit resistor
value, R
ADJ. Note that the RDSON has a positive temperature
coefficient. At 100˚C, the R
DSON may be as much as 150%
higher than the 25˚C value. This increase in R
DSON must be
considered when determining R
ADJ
in wide temperature
range applications. If the current limit is set based upon 25˚C
ratings, then false current limiting can occur at high tempera-
ture.
Keeping the gate capacitance below 2000pF is recom-
mended to keep switching losses and transition times low.
This will also help keep the PFET drive current low, which
will improve efficiency and lower the power dissipation within
the controller.
As gate capacitance increases, operating frequency should
be reduced and as gate capacitance decreases operating
frequency can be increased.
www.national.com
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