Advanced Low Power Schottky Logic – 54ALS86

Quadruple 2-Input Exclusive OR Gate IC in bare die form



High speed – 3ns (Min) propagation delay



Full Military Temperature Range.

Rev 1.0

01/11/22

Features:

Die Size (Unsawn)

1500 x 1400

59 x 55

µm

mils

Minimum Bond Pad Size

130 x 130

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si



Direct drop-in replacement for obsolete

components in long term programs.

Ordering Information

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection

The 54ALS86 is fabricated using a 1.5µm 40V Bipolar

process. The device contains four independent gates and

performs the Boolean functions Y = A ⊕ B = AB + AB in

positive logic. The device is characterized over the full

Military Temperature Range.

Description

Die Dimensions in µm (mils)

1500 (59)



“H” - MIL-STD-883 /2010B

Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

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