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LM4941 Datasheet(PDF) 8 Page - National Semiconductor (TI) |
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LM4941 Datasheet(HTML) 8 Page - National Semiconductor (TI) |
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8 / 13 page ![]() Application Information OPTIMIZING RF IMMUNITY The internal circuitry of the LM4941 suppresses the amount of RF signal that is coupled into the chip. However, certain external factors, such as output trace length, output trace orientation, distance between the chip and the antenna, antenna strength, speaker type, and type of RF signal, may affect the RF immunity of the LM4941. In general, the RF immunity of the LM4941 is application specific. Neverthe- less, optimal RF immunity can be achieved by using short output traces and increasing the distance between the LM4941 and the antenna. DIFFERENTIAL AMPLIFIER EXPLANATION The LM4941 is a fully differential audio amplifier that fea- tures differential input and output stages. Internally this is accomplished by two circuits: a differential amplifier and a common mode feedback amplifier that adjusts the output voltages so that the average value remains V DD / 2. When setting the differential gain, the amplifier can be considered to have "halves". Each half uses an input and feedback resistor (R i1 and RF1) to set its respective closed-loop gain (see Figure 1). With R i1 =Ri2 and RF1 =RF2, the gain is set at -R F /Ri for each half. This results in a differential gain of A VD =-RF/Ri (1) It is extremely important to match the input resistors to each other, as well as the feedback resistors to each other for best amplifier performance. See the Proper Selection of Exter- nal Components section for more information. A differential amplifier works in a manner where the difference between the two input signals is amplified. In most applications, input signals will be 180˚ out of phase with each other. The LM4941 can be used, however, as a single ended input amplifier while still retaining its fully differential benefits be- cause it simply amplifies the difference between the inputs. All of these applications provide what is known as a "bridged mode" output (bridge-tied-load, BTL). This results in output signals at V o1 and Vo2 that are 180˚ out of phase with respect to each other. Bridged mode operation is different from the single-ended amplifier configuration that connects the load between the amplifier output and ground. A bridged amplifier design has distinct advantages over the single- ended configuration: it provides differential drive to the load, thus doubling maximum possible output swing for a specific supply voltage. Four times the output power is possible compared with a single-ended amplifier under the same conditions. This increase in attainable output power as- sumes that the amplifier is not current limited or clipped. In order to choose an amplifier’s closed-loop gain without caus- ing excess clipping, please refer to the Audio Power Am- plifier Design section. A bridged configuration, such as the one used in the LM4941, also creates a second advantage over single- ended amplifiers. Since the differential outputs, V o1 and Vo2, are biased at half-supply, no net DC voltage exists across the load. This assumes that the input resistor pair and the feedback resistor pair are properly matched (see Proper Selection of External Components). BTL configuration eliminates the output coupling capacitor required in single- supply, single-ended amplifier configurations. If an output coupling capacitor is not used in a single-ended output con- figuration, the half-supply bias across the load would result in both increased internal IC power dissipation as well as permanent loudspeaker damage. Further advantages of bridged mode operation specific to fully differential amplifiers like the LM4941 include increased power supply rejection ratio, common-mode noise reduction, and click and pop reduction. POWER DISSIPATION Power dissipation is a major concern when designing a successful amplifer, whether the amplifier is bridged or single-ended. Equation 2 states the maximum power dissi- pation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load. P DMAX =(VDD) 2 /(2 π2R L) Single-Ended (2) However, a direct consequence of the increased power de- livered to the load by a bridge amplifier is an increase in internal power dissipation versus a single-ended amplifier operating at the same conditions. P DMAX =4*(VDD) 2 /(2 π2R L) Bridge Mode (3) Since the LM4941 has bridged outputs, the maximum inter- nal power dissipation is 4 times that of a single-ended am- plifier. Even with this substantial increase in power dissipa- tion, the LM4941 does not require additional heatsinking under most operating conditions and output loading. From Equation 3, assuming a 5V power supply and an 8 Ω load, the maximum power dissipation point is 625mW. The maxi- mum power dissipation point obtained from Equation 3 must not be greater than the power dissipation results from Equa- tion 4: P DMAX =(TJMAX -TA)/ θ JA (4) The LM4941’s θ JA in an TMD09XXX package is 100˚C/W. Depending on the ambient temperature, T A, of the system surroundings, Equation 4 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 3 is greater than that of Equation 4, then either the supply voltage must be decreased, the load impedance increased, the ambient temperature reduced, or the θ JA reduced with heatsinking. In many cases, larger traces near the output, V DD, and GND pins can be used to lower the θ JA. The larger areas of copper provide a form of heatsinking allowing higher power dissipation. For the typical application of a 5V power supply, with an 8 Ω load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 110˚C pro- vided that device operation is around the maximum power dissipation point. Recall that internal power dissipation is a function of output power. If typical operation is not around the maximum power dissipation point, the LM4941 can operate at higher ambient temperatures. Refer to the Typical Per- formance Characteristics curves for power dissipation in- formation. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection ratio (PSRR). The capacitor location on both the bypass and power supply pins should be as close to the www.national.com 8 |
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