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SP2525A Datasheet(PDF) 4 Page - Sipex Corporation |
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SP2525A Datasheet(HTML) 4 Page - Sipex Corporation |
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4 / 9 page  4 Date: 5/3/06 Rev I SP2525A USB High-Side Power Switch © Copyright 2006 Sipex Corporation Error Flag The Error Flag is an open-drained output of an N-channel MOSFET, the FLG output is pulled low to signal the following fault con- ditions: input undervoltage, output current limit, and thermal shutdown. Current Limit The current limit threshold is preset inter- nally. It protects the output MOSFET switches from damage resulting from un- desirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the SP2525A al- lows a minimum current of 0.5A through the MOSFET switches. A current limit condi- tion will signal the Error Flag. Thermal Shutdown When the temperature of the SP2525A exceeds 135ºC for any reasons, the ther- mal shutdown function turns off the MOSFET switch and signals the Error Flag. A hysteresis of 10ºC prevents the MOSFETs from turning back on until the chip tempera- ture drops below 125ºC. Supply Filtering A 0.1µF to 1µF bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause ringing on the input (from sup- ply lead inductance) which can damage internal control circuitry. APPLICATION INFORMATION Transient Requirements USB supports dynamic attachment (hot plug- in) of peripherals. A current surge is caused by the input capacitance of a downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hot-attachment by fil- tering high-frequency signals. Short Circuit Transient Bulk capacitance provides the short-term transient current needed during a hot-attach- ment event. A 33 µF/16V tantalum or a 100µF/ 10V electrolytic capacitor mounted close to the downstream connector at each port should provide sufficient transient drop protection. Printed Circuit Layout The Power circuitry of USB printed circuit boards requires a customized layout to maxi- mize thermal dissipation and to minimize voltage drop and EMI. Input and Output The independent solid state switch connects the IN pin to the OUT pin when enabled by a logic signal at EN. The IN pin is the power supply connection to the internal circuitry and the drain of the output MOSFET. The OUT pin is the source for the MOSFET. Typically, the current in USB application will flow through the switch from IN to OUT towards the load. If VOUT is greater than VIN when a switch is enabled, the current will flow from OUT to the IN pin because the MOSFET channels are bidirectional when switched on. The output source is allowed to be externally forced to a higher voltage than its input without causing unwanted current flow when the output is disabled. |
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