TS8510VB

www.vishay.com

Vishay Semiconductors

Rev. 1.0, 06-Feb-18

3

Document Number: 84402

For technical questions, contact: optochipsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Note

• All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.



The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip

backside is performed with stereo microscope with incident light and 40x to 80x magnification.



The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure

by QM is not installed

HANDLING AND STORAGE CONDITIONS

• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.

It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment

• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as

defined in MIL-HDBK-263

• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used

PACKING

Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the

wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence

(humidity and contamination).

Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take

back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for

packing material that is returned unsorted or which we are not obliged to accept.

MECHANICAL DIMENSIONS

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

Length of chip edge (x-direction)

Lx

-

0.260

-

mm

Length of chip edge (y-direction)

Ly

-

0.260

-

mm

Die height

H

-

0.17

-

mm

Diameter of bondpad

d

0.08

0.09

0.10

mm

ADDITIONAL INFORMATION

Frontside metallization, cathode

Gold alloy

Backside metallization, anode

Gold alloy

Dicing

Sawing

Die bonding technology

Epoxy bonding