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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

WED2ZLRSP01S

April, 2002

Rev. 0

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

Part Number

Configuration

tCD

(ns)

Clock

(MHz)

Operating

Range

Temperature

Range

WED2ZLRSP01S35BC

512K x 32/256K x 32

3.5

166

Commercial

0° - 70° C

WED2ZLRSP01S38BC

512K x 32/256K x 32

3.8

150

Commercial

0° - 70°C

WED2ZLRSP01S42BC

512K x 32/256K x 32

4.2

133

Commercial

0° - 70°C

WED2ZLRSP01S50BC

512K x 32/256K x 32

5.0

100

Commercial

0° - 70°C

WED2ZLRSP01S38BI

512K x 32/256K x 32

3.8

150

Industrial

-40° - 85°C

WED2ZLRSP01S42BI

512K x 32/256K x 32

4.2

133

Industrial

-40° - 85°C

WED2ZLRSP01S50BI

512K x 32/256K x 32

5.0

100

Industrial

-40° - 85°C

PACKAGE DIMENSION: 153 BUMP PBGA

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

ORDERING INFORMATION

NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.

17.00

23.00

3.50

10.00

1.00

18.00

2.5

.60 ± .050

0.50 ± 10

2.33 Max

Commercial Temp Range (0°C to 70°C)