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STD45NF75 Datasheet(PDF) 6 Page - STMicroelectronics |
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STD45NF75 Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 12 page ![]() STD45NF75 6/12 Thermal Resistance Rthj-a vs PCB Copper Area Allowable Iav vs. Time in Avalanche Max Power Dissipation vs PCB Copper Area The previous curve gives the safe operating area for unclamped inductive loads, single pulse or repetitive, under the following conditions: PD(AVE) = 0.5 * (1.3 * BVDSS * IAV) EAS(AR) = PD(AVE) * tAV Where: IAV is the Allowable Current in Avalanche PD(AVE) is the Average Power Dissipation in Avalanche (Single Pulse) tAV is the Time in Avalanche To derate above 25 oC, at fixed IAV, the following equation must be applied: IAV = 2 * (Tjmax - TCASE)/ (1.3 * BVDSS * Zth) Where: Zth = K * Rth is the value coming from Normalized Thermal Response at fixed pulse width equal to TAV . |
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