EFP01 datasheet(153/158 Pages) SILABS

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Table 9.2. QFN20 PCB Land Pattern Dimensions

Dimension

Typ

3.00

1.80

0.50

2.45

0.30

0.80

0.15

0.05

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3. This Land Pattern Design is based on the IPC-SM-782 guidelines.

4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri-

cation Allowance of 0.05mm.

5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm

minimum, all the way around the pad.

6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

7. The stencil thickness should be 0.125 mm (5 mils).

8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.

9. The above notes and stencil design are shared as recommendations only. The customer may find it necessary to use different

parameters and fine tune their SMT process as required for their application and tooling

10. A No-Clean, Type-3 solder paste is recommended.

11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.

EFP01 Energy Friendly PMIC Family Data Sheet

QFN20 Package Specifications

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EFP01 Datasheet(PDF) 153 Page - Silicon Laboratories