Analog Integrated Circuit Device Data

4

Freescale Semiconductor

34671

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Input Voltage Range

VIN Pin

PPR and CHG Pins

EN, BAT, ISET, and FAST Pins

VIN

VPPR, VCHG

VEN, VBAT,

VISET, VFAST

-0.3 to 28

-0.3 to 12

-0.3 to 5.5

V

ESD Voltage(1)

Human Body Model (HBM)

Machine Model (MM)

VESD

±2000

±200

V

THERMAL RATINGS

Operating Temperature

Ambient

Junction

TA

TJ

-40 to 85

-40 to 150

°C

Storage Temperature

TSTG

-65 to 150

°C

Thermal Resistance(2)

Junction-to-Case

Junction-to-Ambient

RθJC

RθJA

10

70

°C/W

Peak Package Reflow Temperature During Reflow(3),(4)

TPPRT

Note 4

°C

Notes

1.

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω), and the Machine Model

(MM) (CZAP = 200pF, RZAP = 0Ω).

2.

Device mounted on the Freescale EVB test board per JEDEC DESD51-2.

3.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

4.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.