US1AF THRU US1MF

Features

· Ideal for printed circuit board

· Low forward voltage drop

· Low reverse leakage

· Ultrafast reverse recovery time

· High forward surge capability

· High temperature soldering :

260℃/10seconds at terminals

· Component in accordance to

RoHS 2011/65/EU

Maximum Ratings and Electrical Characteristics (TA=25°C unless otherwise noted)

ULTRAFAST RECOVERY RECTIFIER

CURRENT 1.0 A

VOLTAGE 50 to 1000 V

Mechanical Data

· Case : SMAF Molding compound meets

UL 94 V-0 flammability rating

· Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

· Polarity : Laser band denotes cathode end

Dimensions in inches and (millimeters)

Maximum recurrent peak reverse voltage

Maximum RMS voltage

Typical thermal resistance from juction to ambient

Maximum average forward rectified current

at TL=100℃

V

V

Symbols

Units

A

Maximum DC reverse current

at rated DC blocking voltage

V

TA=25℃

TA=125℃

Items

VRRM

1.0

TJ , TSTG

50

Maximum DC blocking voltage

IFSM

30

500

V

pF

Maximum reverse recovery time (1)

IR

TRR

5

Peak forward surge current 8.3ms single half

sine-wave superimposed on rated load

VRMS

IF(AV)

VF

Typical junction capacitance (2)

Typical thermal resistance from juction to lead

20

Operating junction and storage

temperature range

℃/W

℃/W

US1AF

Maximum instantaneous forward voltage at 1.0A

1.0

1.3

1.7

-55 to +150

℃

RθJL

50

75

Notes:

(1) Reverse recovery test conditions : IF=0.5A, IR=1.0A, Irr=0.25A.

(2) Measured at 1MHz and applied reverse voltage of 4.0Volts.

US1DF US1GF US1JF US1KF US1MF

200

400

600

800

1000

35

140

280

420

560

700

50

100

US1BF

70

100

200

400

600

800

1000

VDC

RθJA

CJ

30

70

A

μA

ns

https://dec.co.kr

DAESAN ELECTRONIC CORP.

SMAF

0.002(0.05)

0.011(0.30)

0.035(0.90)

0.051(1.30)

0.130(3.30)

0.146(3.70)

0.090(2.30)

0.110(2.80)

0.047(1.20)

0.063(1.60)

0.019(0.50) Min.

0.169(4.30)

0.193(4.90)