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CS1311 Datasheet(PDF) 24 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # CS1311
Description  Media Coprocessor
PDF  25 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

CS1311 Datasheet(HTML) 24 Page - National Semiconductor (TI)

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24
Revision 2.2
Appendix A
Support Documentation
A.1
ORDERING INFORMATION
A.2
CUSTOMER SUPPORT
National is the primary contact for all technical support issues. For certain software modules listed, National does not have
access to source code. For these software modules, National will work directly with intellectual property owners of these
software modules to provide customer support.
A.3
PRODUCT BRIEF REVISION HISTORY
This section is a report of the revision/creation process of the product brief for the Geode CS1301/CS1311. Any revisions
(i.e., additions, deletions, parameter corrections, etc.) are recorded in the table below.
Note:
This product brief must be used in conjunction with the Philips Semiconductor
PNX1300 Series Media Processors
Data Book for a complete understanding of the CS1301/CS1311 (posted on National’s IA Developer’s web site).
Order Number
(NSID)
Part Marking
Core
Frequency
(MHz)
Core
Voltage
(V)
Temperature
(Degree C)
Package
CS1301
CS1301
180
2.5
0 - 85
TEPBGA
CS1311
CS1311
166
2.2
0 - 85
TEPBGA
Note:
Due to licensing agreements, the CS1301/CS1311 can only be purchased by those customers using a Geode
processor-based design.
Table A-1. Revision History
Revision #
(PDF Date)
Revisions / Comments
1.0
(November 2001)
First draft of product brief. (Confidential)
2.0
(April 2002)
Updated to include a list of supported software and software block diagram. (Confidential)
2.1
(July 2002)
Updated to include Signal Definitions and Package Specifications sections. (No longer confiden-
tial, to be posted on National external web site in the product folders.)
2.2
(August 2002)
Replaced “Product Brief” with “Preliminary”. Updated package specifications to use National sup-
plied drawing and changed HBGA to TEPBGA. (These changes were made to meet Corporate
standard requirements, revision 2.1 was never posted on National external web site.)



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