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ICM7170IPG Datasheet(PDF) 10 Page - Renesas Technology Corp

Part # ICM7170IPG
Description  Microprocessor-Compatible, Real-Time Clock
PDF  14 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ICM7170IPG Datasheet(HTML) 10 Page - Renesas Technology Corp

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ICM7170
FN3019 Rev.6.00
Page 10 of 14
Nov 2003
The new load configuration (Figure 6) allows these two
conditions to be met independently. The two load capacitors, C1
and C2, provide a fixed load to the oscillator and crystal. C3
adjusts the frequency that the circuit resonates at by reducing
the effective value of the crystal's motional capacitance, C0. This
minute adjustment does not appreciably change the load of the
overall system, therefore, stability is no longer affected by
tuning. Typical values for these capacitors are shown in Table 5.
C1 and C2 must always be greater than twice the crystal’s
recommended load capacitance in order for C3 to be able to trim
the frequency. Some experimentation may be necessary to
determine the ideal values of C1 and C2 for a particular crystal.
This three capacitor tuning method will be more stable than the
original design and is mandatory for 32kHz tuning fork crystals:
without it they may leap into an overtone mode when power is
initially applied.
The original two-capacitor circuit (Figure 8) will continue to
work as well as it always has, and may continue to be used in
applications where cost or space is a critical consideration. It is
also easier to tune to frequency since one end of the trimmer
capacitor is fixed at the AC ground of the circuit (VDD),
minimizing the disturbance cause by contact between the
adjustment tool and the trimmer capacitor. Note that in both
configurations the load capacitors are connected between the
oscillator pins and VDD - do not use VSS as an AC ground.
Layout: Due to the extremely low current (and therefore high
impedance) design of the ICM7170s oscillator, special
attention must be given to the layout of this section. Stray
capacitance should be minimized. Keep the oscillator traces on
a single layer of the PCB. Avoid putting a ground plane above
or below this layer. The traces between the crystal, the
capacitors, and the ICM7170 OSC pins should be as short as
possible. Completely surround the oscillator components with
a thick trace of VDD to minimize coupling with any digital
signals. The final assembly must be free from contaminants
such as solder flux, moisture, or any other potential sources of
leakage. A good solder mask will help keep the traces free of
moisture and contamination over time.
Oscillator Tuning
Trimming the oscillator should be done indirectly. Direct
monitoring of the oscillator frequency by probing OSC IN or
OSC OUT is not accurate due to the capacitive loading of most
probes. One way to accurately trim the ICM7170 is by turning
on the 1 second periodic interrupt and trimming the oscillator
until the interrupt period is exactly one second. This can be
done as follows:
1.Turn on the system. Write a 00H to the Interrupt Mask Register (lo-
cation 10H) to clear all interrupts.
2. Set the Command Register (location 11H) for the appropriate
crystal frequency, set the Interrupt Enable and Run/Stop bits to 1,
and set the Test bit to 0.
3. Write a 08H to the Interrupt Mask Register to turn on the 1s
interrupt.
4. Write an interrupt handler to read the Interrupt Status Register after
every interrupt. This resets the interrupt and allows it to be set
again. A software loop that reads the Interrupt Status Register
several times each second will accomplish this also.
5. Connect a precision period counter capable of measuring 1s within
the accuracy desired to the interrupt output. If the interrupt is
configured as active low, trigger on the falling edge. If the interrupt
is active high, trigger on the rising edge. Be sure to measure the
period between when the transistor turns ON, and when the
transistor turns ON a second later.
6. Adjust C3 (C2 for the two-capacitor load configuration) for an
interrupt period of exactly 1.000000 seconds.
Application Notes
Digital Input Termination During Backup
To ensure low current drain during battery backup operation,
none of the digital inputs to the ICM7170 should be allowed to
float. This keeps the input logic gates out of their transition
region, and prevents crossover current from flowing which will
shorten battery life. The address, data, CS, and ALE pins
should be pulled to either VDD or VSS, and the RD and WR
inputs should be pulled to VDD. This is necessary whether the
internal battery switchover circuit is used or not.
IBM/PC Evaluation Circuit
Figure 9 shows the schematic of a board that has been
designed to plug into an IBM PC/XT (Note 1) or compatible
computer. In this example CS is permanently tied low and
access to the chip is controlled by the RD and WR pins. These
signals are generated by U1, which gates the IBM’s lOR and
lOW with a device select signal from U3, which is functioning
as an I/O block address decoder. DS1 selects the interrupt
priority.
TABLE 5. TYPICAL LOAD CAPACITOR VALUES
CRYSTAL
FREQUENCY
LOAD CAPS
(C1, C2)
TRIMMER CAP
(C3)
32kHz
33pF
5 - 50pF
1MHz
33pF
5 - 50pF
2MHz
25pF
5 - 50pF
4MHz
22pF
5 - 100pF
OSC IN
10
ICM7170
OSC OUT
VDD
23
C1
C2
X1
9
VDD
C12 x LOAD
C2
5pF - 35pF
FIGURE 8. ORIGINAL OSCILLATOR CONFIGURATION



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