FN3335 Rev 0.00

Page 8 of 8

December 1992

CD4503BMS

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in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

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modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

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Chip Dimensions and Pad Layout

Dimensions in parenthesis are in millimeters and are

derived from the basic inch dimensions as indicated.

Grid graduations are in mils (10-3 inch).

METALLIZATION:

Thickness: 11k

Å 14kÅ, AL.

PASSIVATION:

10.4kÅ - 15.6k

Å, Silane

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches