MAX22663–MAX22666

Reinforced, Fast, Low-Power,

Six-Channel Digital Isolators

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Analog Devices | 2

Absolute Maximum Ratings

VDDA to GNDA.....................................................-0.3V to +6V

VDDB to GNDB.....................................................-0.3V to +6V

IN_ on Side A to GNDA ........................................-0.3V to +6V

IN_ on Side B to GNDB ........................................-0.3V to +6V

OUT_ on Side A to GNDA ................... -0.3V to (VDDA + 0.3V)

OUT_ on Side B to GNDB ................... -0.3V to (VDDB + 0.3V)

Short-Circuit Continuous Current

__OUT_ on Side A to GNDA ........................................ ±30mA

__OUT_ on Side B to GNDB.........................................±30mA

Continuous Power Dissipation (TA = +70°C)

__Wide SOIC (derate 14.95mW/°C above +70°C) 1195.81mW

Temperature Ratings

__Operating Temperature Range .................. -40°C to +125°C

__Maximum Junction Temperature.............................. +150°C

__Storage Temperature Range ..................... -60°C to +150°C

__Lead Temperature (soldering, 10s) .......................... +300°C

__Soldering Temperature (reflow)................................ +260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

PACKAGE TYPE: 16 WIDE SOIC

Package Code

W16MS+13

Outline Number

21-0042

Land Pattern Number

90-0107

THERMAL RESISTANCE, FOUR LAYER BOARD:

Junction-to-Ambient (θJA)

66.90°C/W

Junction-to-Case Thermal Resistance (θJC)

42.50°C/W

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed

information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to http://www.maximintegrated.com/packages. Note that a “+”, “#”,

or “-“ in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the

package regardless of RoHS status.