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BD830 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BD830 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 Apr 21 3 Philips Semiconductors Product specification PNP power transistor BD830 THERMAL CHARACTERISTICS CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air 62.5 K/W Rth j-mb thermal resistance from junction to mounting base 12.5 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = −30 V −−−100 nA IE = 0; VCB = −30 V; Tj = 125 °C −−−10 µA IEBO emitter cut-off current IC = 0; VEB = −5V −−−100 nA hFE DC current gain VCE = −2 V; see Fig.2 IC = −5mA 40 −− IC = −150 mA 63 − 250 IC = −500 mA 25 −− VCEsat collector-emitter saturation voltage IC = −500 mA; IB = −50 mA −−−500 mV VBE base-emitter voltage IC = −500 mA; VCE = −2V −−−1V fT transition frequency IC = −50 mA; VCE = −5 V; f = 100 MHz − 75 − MHz Fig.2 DC current gain; typical values. handbook, full pagewidth 0 160 80 120 40 MBH730 −10−1 hFE −1 IC (mA) −10 −103 −104 −102 VCE = −2 V |
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