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FSFLK Datasheet(PDF) 28 Page - NXP Semiconductors |
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FSFLK Datasheet(HTML) 28 Page - NXP Semiconductors |
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28 / 37 page ![]() Test Descriptions 28 Freescale Sensor Fusion Library for Kinetis MCUs, Rev. 0.7, 9/2015 Freescale Semiconductor, Inc. 1. Output sampling period = 40 ms 2. Number of output sampling periods where one period = 40 ms 4.8.8 3-axis Accelerometer Only Parametrics NOTE: All parametrics provided in the following table are based on build 4.17 simulations. Build 5.00 should be similar. Table 18. 3-axis Accelerometer Performance Metrics Characteristics Symbol Conditions Min Typ Max Units Tilt Error RMS TAE Note 1 — 0.082 — degrees Orientation response delay ORD See Orientation Response Delay 2 — < 5 — output sample period 1. RMS of accelerometer tilt angle error is calculated using the simulated sensor noise RMS values along each of the three axes and the following formula (given for tilt error from the z-axis) TAE=arctan , where NRMSx, NRMSy, NRMSz - RMS values of accelerometer noise for X, Y, Z axes in g units. 2. Number of output sampling periods where one period = 40 ms 5 Test Descriptions Each of the following sub-sections defines the specification intent and the sample procedure for the specifications listed in Mechanical and Electrical Specifications. Procedures may evolve in future drafts of this document in order to better service the specification intents. 5.1 MCU Current 5.1.1 Intent This is the average current consumption of the MCU executing the core Fusion routines. This is obviously specific to the particular MCUs listed. This metric must be associated with a specific hardware configuration similar to those defined earlier in this document. The Freedom Development Platform was powered via the OpenSDA USB port for the results specified. 5.1.2 Procedure 1. This procedure uses modified versions of the standard demo build: a. Measure (using the Sensor Fusion Toolbox) sysTickfusion which only includes time spent in the core fusion routines. It does not include: 1) calls to magnetic calibration 2) reading sensor data 3) applying hardware abstraction layer 4) RTOS 5) Communications overhead |
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