Nexperia

HPZR series

4.1 W high power voltage regulator diodes

12. Soldering

SOD123W

Footprint information for reflow soldering of CFP3 package

sod123w_fr

Issue date 17-06-09

20-02-28

occupied area

solder land

solder resist

solder paste

Dimensions in mm

1.1

1.1

1.2 1.4

recommended stencil thickness: 0.1 mm

1.6

2.1

1.2

1.4

4.4

2.9

2.8

Fig. 8. Reflow soldering footprint for CFP3 (SOD123W)

HPZR_SER

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Nexperia B.V. 2023. All rights reserved

Product data sheet

Rev. 4 — 10 March 2023

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