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MA5821

Major Power Technology Co., Ltd.

Rev.1.1

24th, Sep., 2021

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PIN ASSIGNMENT

The package of MA5821 is MSOP10L-EP (Exposed pad); the pin assignment is given by:

( Top view )

MSOP-10L-EP

GND

FB

GH

HGC

VDD

VIN

SENSE

COMP

1

2

3

4

5

6

7

8

9

10

EN

LX

E-PAD

(GND)

Name

Description

HGC Supply high-side gate driver. Decouple this pin to VIN pin with 0.1uf ceramic CAP (e.g.

X5R) and 18kΩ

EN

Enable Control. ( internal pull high ).

COMP Compensation Node. Connect a series RC network from COMP to GND.

FB

Feedback Input. FB senses the output voltage to regulate that voltage. Drive FB with a

resistive voltage divider from the output voltage.

VDD

Internal Regulator Pin

GND Ground.

LX

Switching node and Switching sense pin.

GH

Gate driver for external high-side PMOS.

SENSE

Power Input and Current Limit SENSE pin. Bypass SENSE (of High-side PMOS) to

Ground with high capacitance 4.7uF ceramic MLCC (e.g. X5R) to eliminate noise. Ensure

a very large SENSE area for high-side PMOS cooling.

VIN

Power Input. Bypass VIN to Ground with a suitably high capacitance E-CAP to eliminate

noise, and bypass IC PIN10-VIN to pin6-GND with a 0.1uf ceramic MLCC (e.g. X5R.)

E-PAD Exposed pad. Connect to GND.

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ORDER/MARKING INFORMATION

Order Information

Top Marking

Package Type

MA5821

Packing

A : Taping

XX X

EM: MSOP10L-EP

Blank: Tube

X X X X X

MA5 8 2 1 Part number

ID code:internal

WW:01~52

Year:18=2018