FXPQ3115BVS datasheet(4/49 Pages) NXP

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NXP Semiconductors

FXPQ3115BVS

I2C precision pressure sensor with altimetry

7 System connections

SCL

FXPQ3115BVS

SDL

INT1

INT2

VDD

VDDIO

aaa-044130

100 nF

10 µF

100 nF

Figure 3. Typical application diagram

The device power is supplied through the VDD line. Power supply decoupling capacitors (100 nF ceramic plus

10 μF bulk or 10 μF ceramic) should be placed as near as possible to pin 1 of the device. A second 100 nF

capacitor is used to bypass the internal regulator. The functions, threshold, and the timing of the interrupt pins

(INT1 and INT2) are user programmable through the I2C interface.

8 Handling and board mount recommendations

The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied

accuracy of pressure measurement. Avoid such exposure to the port during normal operation.

8.1 Methods of handling

Components can be picked from the carrier tape using either the vacuum assist or the mechanical type

pickup heads. A vacuum assist nozzle type is most common due to its lower cost of maintenance and ease of

operation. The recommended vacuum nozzle configuration should be designed to make contact with the device

directly on the metal cover and avoid vacuum port location directly over the vent hole in the metal cover of the

device. Multiple vacuum ports within the nozzle may be required to effectively handle the device and prevent

shifting during movement to placement position.

Vacuum pressure required to adequately support the component should be approximately 25 in Hg (85 kPa).

This level is typical of in-house vacuum supply. Pickup nozzles are available in various sizes and configurations

to suit a variety of component geometries. To select the nozzle best suited for the specific application, NXP

recommends that the customer consult their pick and place equipment supplier to determine the correct nozzle.

In some cases it may be necessary to fabricate a special nozzle depending on the equipment and speed of

operation.

Tweezers or other mechanical forms of handling that have a sharp point are not recommended since they can

inadvertently be inserted into the vent hole of the device. This can lead to a puncture of the MEMS element that

will render the device inoperable.

8.2 Board mount recommendations

Components can be mounted using solder paste stencil, screen printed or dispensed onto the PCB pads prior

to placement of the component. The volume of solder paste applied to the PCB is normally sufficient to secure

FXPQ3115BVS

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1.3 — 8 May 2023

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