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BFG505/X Datasheet(PDF) 4 Page - NXP Semiconductors |
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BFG505/X Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 16 page ![]() 1998 Oct 02 4 Philips Semiconductors Product specification NPN 9 GHz wideband transistors BFG505W; BFG505W/X CHARACTERISTICS Tj =25 °C unless otherwise specified. Notes 1. GUM is the maximum unilateral power gain, assuming S12 is zero. 2. IC = 5 mA; VCE =6V; RL =50 Ω; Tamb =25 °C; fp = 900 MHz; fq = 902 MHz; measured at 2fp − fq = 898 MHz and 2fq − fp = 904 MHz. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)CBO collector-base breakdown voltage IC = 2.5 µA; IE =0 20 −− V V(BR)CES collector-emitter breakdown voltage IC =10 µA; RBE =0 15 −− V V(BR)EBO emitter-base breakdown voltage IE = 2.5 µA; IC = 0 2.5 −− V ICBO collector leakage current VCB =6V; IE =0 −− 50 nA hFE DC current gain IC = 5 mA; VCE = 6 V see Fig.3 60 120 250 fT transition frequency IC = 5 mA; VCE = 6 V; f = 1 GHz; Tamb =25 °C; see Fig.5 − 9 − GHz Cc collector capacitance IE =ie = 0; VCB =6V; f=1MHz − 0.3 − pF Ce emitter capacitance IC =ic = 0; VEB = 0.5 V; f = 1 MHz − 0.4 − pF Cre feedback capacitance IC = 0; VCB = 6 V; f = 1 MHz; see Fig.4 − 0.2 − pF GUM maximum unilateral power gain; note 1 IC = 5 mA; VCE = 6 V; f = 900 MHz; Tamb =25 °C − 19 − dB IC = 5 mA; VCE = 6 V; f = 2 GHz; Tamb =25 °C − 12 − dB |S21|2 insertion power gain IC = 5 mA; VCE = 6 V; f = 900 MHz; Tamb =25 °C 15 16 − dB F noise figure Γs =Γopt; IC = 1.25 mA; VCE =6V; f = 900 MHz − 1.2 1.7 dB Γ s =Γopt; IC = 5 mA; VCE =6V; f = 900 MHz − 1.6 2.1 dB Γ s =Γopt; IC = 1.25 mA; VCE =6V; f = 2 GHz − 1.9 − dB PL1 output power at 1 dB gain compression IC = 5 mA; VCE = 6 V; f = 900 MHz; RL =50 Ω; Tamb =25 °C − 4 − dBm ITO third order intercept point note 2 − 10 − dBm G UM 10 S 21 2 1S 11 2 – () 1S 22 2 – () -------------------------------------------------------------- dB. log = |
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