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BFQ231 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BFQ231 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1997 Oct 02 3 Philips Semiconductors Product specification NPN video transistors BFQ231; BFQ231A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. Ts is the temperature at the soldering point of the collector pin, 4 mm from the body. 2. Transistor mounted on a printed-circuit board with a metallized pad area of 10 mm2. THERMAL CHARACTERISTICS Note 1. Ts is the temperature at the soldering point of the collector pin. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter BFQ231 − 100 V BFQ231A − 115 V VCEO collector-emitter voltage open base BFQ231 − 65 V BFQ231A − 95 V VCER collector-emitter voltage RBE = 100 Ω BFQ231 − 95 V BFQ231A − 110 V VEBO emitter-base voltage open collector − 3V IC collector current (DC) − 300 mA Ptot total power dissipation Ts ≤ 65 °C; notes 1 and 2; see Fig.3 − 1W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to soldering point note 1 85 K/W Rth j-a thermal resistance from junction to ambient 185 K/W Rth s-a thermal resistance from soldering point to ambient 100 K/W |
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