MAX38913

4µVRMS Ultra-Low-Noise 1A LDO with

Two-Level Output Voltage Selection

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Absolute Maximum Ratings

IN, OUT, OUTS to GND ....................................... -0.3V to +6V

BYP to GND.......................................................... -0.3V to +2V

EN1, EN2, POK, PORB to GND ........................... -0.3V to +6V

RSEL1, RSEL2 to GND ..............................-0.3V to VIN + 0.3V

Output Short-Circuit Duration.................................. Continuous

Continuous Power Dissipation (TA = +70°C).............................

WLP (derate 13.73mW/°C above +70°C) ................... 1096mW

TDFN (derate 24.4mW/

C above +70C)................ 1951.2mW

Operating Junction Temperature Range ........ -40°C to +125°C

Maximum Junction Temperature ...................................+150°C

Storage Temperature Range.......................... -65°C to +150°C

Lead Temperature (soldering, 10 seconds) ..................+300°C

Soldering Temperature (reflow).....................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

WLP

Package Code

N121E1+1

Outline Number

21-100500

Land Pattern Number

Refer to Application Note 1891

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

72.82°C/W

Junction to Case (θJC)

N/A

TDFN

Package Code

T1433+2C

Outline Number

21-0137

Land Pattern Number

90-0063

Thermal Resistance, Single Layer Board:

Junction to Ambient (θJA)

54°C/W

Junction to Case (θJC)

8°C/W

Thermal Resistance, Four Layer Board:

Junction to Ambient (θJA)

41°C/W

Junction to Case (θJC)

8°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or

“-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the

package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For

detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.