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PUMX2 Datasheet(PDF) 3 Page - NXP Semiconductors |
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PUMX2 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 3 of 8 Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 6: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 694 K/W Per device Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 417 K/W Table 7: Characteristics Tamb =25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per transistor ICBO collector-base cut-off current VCB =60V; IE = 0 A - - 100 nA VCB =60V; IE =0A; Tj = 150 °C --50 µA IEBO emitter-base cut-off current VEB =7V; IC = 0 A - - 100 nA hFE DC current gain VCE =6V; IC = 1 mA 120 250 560 VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5 mA - - 250 mV fT transition frequency VCE =12V; IE = 2 mA; f = 100 MHz 100 - - MHz Cc collector capacitance VCB =12V; IE =ie =0A; f = 1 MHz --3 pF |
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