S75WS-P_00_02 September 6, 2006

S75WS-P based MCP/POP Products

9

Da t a

Sh ee t

( A dv an c e

In f o r m at io n)

6.

Ordering Information

The order number is formed by a valid combinations of the following:

S75WS

256

P

EF

KF

F

LW

0

PACKING TYPE

0 = Tray

2 = 7” Tape and Reel

3 = 13” Tape and Reel

MODEL NUMBER

Refer to the Valid Combinations Table

PACKAGE DESCRIPTOR

Depends on Character 12. For a more detailed description see Table 6.1.

PACKAGE TYPE & MATERIAL SET

HF = 1.2mm MCP FBGA, Pb-free

KF = 1.2mm POP FBGA, Pb-free

JF = 1.4mm MCP FBGA, Pb-free

CellularRAM DENSITY

D0 = 128 Mb

PROCESS TECHNOLOGY

P = 90 nm, MirrorBit

CODE FLASH DENSITY

256 = 256Mb

512 = 512Mb

PRODUCT FAMILY

S71WS Stacked Products (MCP/PoP)

1.8 V NOR Flash with pSRAM

Table 6.1 Character Position Descriptions

Character 12

Character 14

Character 14 Description

Package Area

Package Ball Count

Raw Ball Size

H, J, or G

07x9 mm

56

0.35 mm

17x9 mm

80

2

8x11.6 mm

64

3

8x11.6 mm

84

4

9x12 mm

84

5

9x12 mm

115

6

9x12 mm

137

7

11x13 mm

84

8

11x13 mm

115

9

11x13 mm

137

K

A

11x11 mm

112

0.45 mm

B

11x11 mm

112

0.50 mm

D

12x12 mm

128

0.45 mm

F

12x12 mm

128

0.50 mm

G

14x14 mm

152

0.45 mm

H

14x14 mm

152

0.50 mm

J

15x15 mm

160

0.45 mm

K

15x15 mm

160

0.50 mm

L

17x17 mm

192

0.45 mm

M

17x17 mm

192

0.50 mm